Method of manufacturing an interconnect device which forms a heat sink and electrical connections between a heat generating device and a power source
US7992294B2 · kind B2 · utility
3Cited by
68References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2008 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Feb 18, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.