Method of producing a contactless microelectronic device, such as for an electronic passport
US7992790B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2006 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Dec 4, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a microelectronic device with contactless operation, mainly for electronic passports. An antenna is made on a thin, flexible substrate. A perforated sheet that is thin and calibrated, and that has at least one cavity in its thickness, is placed on the substrate. A microelectronic chip is placed in each cavity of the perforated sheet and the output contacts of the microelectronic chip are connected to corresponding terminals of the antenna. The microelectronic chip is protected by sealing off the cavity that contains the chip. The method is particularly adapted for manufacturing electronic radiofrequency identification devices, in particular for electronic passports.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.