Apparatus and method of electrolytic removal of metals from a wafer surface
US7993498B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 7, 2007 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Apr 15, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H5/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.