Heat shrinkable multilayer film and packaging material using the same
US7993713B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2007 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Jul 20, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31746
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat shrinkable multilayer film comprising an outer surface layer (a) formed of a thermoplastic resin, a first intermediate layer (b1) formed of a polyamide resin, a second intermediate layer (b2) formed of a saponified product of an ethylene-vinyl acetate copolymer, and an inner surface layer (c) formed of a polyolefin resin, whereinthe shrink of the heat shrinkable multilayer film in water at 90° C. is within a range of from 3 to 45% in each of machine and transverse directions, andthe polyamide resin is a mixture of 60 to 90% by weight of an aliphatic polyamide having a melting point of 210° C. or higher and 10 to 40% by weight of an aromatic polyamide comprising isophthalic acid and terephthalic acid as main components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.