Thermal interface material and method for fabricating the same
US7993750B2 · kind B2 · utility
3Cited by
2References
16Claims
0Family size
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Key dates
| Filing date | Dec 18, 2007 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Mar 13, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thermal interface material includes an array of carbon nanotubes with interspaces defined therebetween; and a low melting point metallic material filled in the interspaces. A method for fabricating a thermal interface material, the method includes (a) providing an array of carbon nanotubes with interspaces defined therebetween; and (b) depositing a low melting point metallic material on the carbon nanotubes in the interspaces therebetween to form a metallic layer with the array of carbon nanotubes embedded therein, and thereby, achieving the thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.