System and method of encapsulation

US7993950B2 · kind B2 · utility

Assignee

• Cavendish Kinetics, Inc. · US

Inventors

• Joseph Damian Gordon Lacey · Milpitas, US
• Mickael Renault · San Jose, US
• Vikram Joshi · Los Gatos, US
• James F. Bobey · Gilroy, US
• Robertus Petrus Van Kampen · 's-Hertogenbosch, NL

Key dates

• Filing date: Nov 6, 2008
• Grant date: Aug 9, 2011
• Expiry date: Jun 25, 2029

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0154
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

Embodiments discussed herein generally include methods of fabricating MEMS devices within a structure. The MEMS device may be formed in a cavity above the structure, and additional metallization may occur above the MEMS device. The cavity may be formed by depositing an encapsulating layer over the sacrificial layers that enclose the MEMS device. The encapsulating layer may then be etched to expose portions of the sacrificial layers. The sacrificial layers are exposed because they extend through the sidewalls of the encapsulating layer. Therefore, no release holes are etched through the top of the encapsulating layer. An etchant then removes the sacrificial layers to free the MEMS device and form the cavity and an opening through the sidewall of the encapsulating layer. Another encapsulating layer may then be deposited to seal the cavity and the opening.