Electronic device and method of manufacturing the same
US7993960B2 · kind B2 · utility
3Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2007 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Dec 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/13
Abstract
Provided are an electronic device including a bank structure and a method of manufacturing the same. The method of manufacturing the electronic device requires a fewer number of processes and comprises a direct patterning of insulating layers, such as fluorinated organic polymer layers, is possible using cost-efficient techniques such as inkjet printing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.