Printed wiring board and method for producing the same
US7994433B2 · kind B2 · utility
4Cited by
44References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2009 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Mar 24, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.