Square-wave laser bonding
US7994449B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2005 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Aug 16, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/0823
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present invention provides a square-wave laser seal pattern made by first directing a laser beam onto an shaft while the shaft is moving in a horizontal direction relative to a laser device so as to create a horizontal laser seal bond segment. Next, with the shaft rotating about a shaft longitudinal axis, the laser beam is directed onto the shaft so as to create a vertical laser seal bond segment. By alternately creating and coupling together a plurality of horizontal and vertical laser seal bond segments, a square-wave laser seal is formed around a circumference of the shaft. The shaft's movement in a horizontal direction relative to a laser beam may be either at a constant speed or a variable speed so as to control the amount of laser energy heat impacting the shaft material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.