Debris minimization and improved spatial resolution in pulsed laser ablation of materials
US7994450B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2002 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Nov 10, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and an apparatus of minimizing the deposition of debris onto a sample being ablated. The method comprising the steps of: 1) reducing a laser pulse energy to approximately a threshold level for ablation; and 2) ablating a region of the sample using a multitude of laser pulses, each pulse being sufficiently separated in time to reduce a concentration of ablation products in a gas phase. An apparatus for ablating a region of a sample with a laser beam. The apparatus comprises: 1) a source providing a pulsed laser beam of a certain energy, the source focusing the laser beam on the sample to ablate a region of the sample; and 2) a device for providing a flowing fluid over the region being ablated to remove the ablation products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.