White-light light emitting diode chips and fabrication methods thereof
US7994531B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2009 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Sep 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8516
Abstract
A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.