Method of manufacturing a display substrate using a laser to remove test lines from the substrate without cutting the substrate
US7995156B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2005 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Jan 15, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09G2300/0426
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A display substrate includes a substrate, signal lines and test lines. The substrate includes a pixel region where pixels are disposed, a buffer region surrounding the pixel region and a grinding region surrounding the buffer region. The signal lines pass through the buffer region from the grinding region to provide the pixels with a driving signal. The test lines are disposed on the grinding region and the buffer region, respectively, so that the test lines intersect the signal lines in a lattice structure. Each of the test lines is electrically connected to the signal lines of a first number calculated by dividing a second number of the signal lines by a third number of the test lines. Thus, the performance of the pixels used for displaying an image may be tested more precisely.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.