Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics

US7997087B2 · kind B2 · utility

Inventors

• Rama Venkatasubramanian · Cary, US
• Randall G. Alley · Raleigh, US
• Pratima Addepalli · Saline, US
• Anil J. Reddy · Minneapolis, US
• Edward P. Siivola · Raleigh, US
• Brooks O'Quinn · Mamers, US
• Kip D. Coonley · Durham, US
• John Posthill · Chapel Hill, US
• Thomas Colpitts · Durham, US

Key dates

• Filing date: Mar 13, 2009
• Grant date: Aug 16, 2011
• Expiry date: Apr 29, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.