Polishing composition and polishing method
US7998229B2 · kind B2 · utility
3Cited by
12References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 2, 2007 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Jun 28, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The polishing composition contains polyoxyethylene sorbitan mono-fatty acid ester, silicon dioxide, water soluble cellulose, an alkaline compound, and water. The content of polyoxyethylene sorbitan mono-fatty acid ester in the polishing composition is less than 0.0025% by mass. The polishing composition is appropriate for final polishing of silicon wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.