Heatshield having strain compliant matrix and method of forming same

US7998295B2 · kind B2 · utility

Assignee

• The Boeing Company · US

Inventors

• Conley Siddoway Thatcher · Placentia, US
• John S. Jones · Anaheim, US
• Jeffrey D. Eichinger · Willow View Lane, US
• Brian L. Muench · Tecate Mission Road, US
• Tab Hunter Crooks · Dana Point, US
• Edwin B. Curry · La Habra, US

Key dates

• Filing date: Jun 13, 2008
• Grant date: Aug 16, 2011
• Expiry date: Nov 20, 2028

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24157
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A method of forming a heat shield that involves thermally stabilizing a plurality of phenolic microspheres; mixing the thermally stabilized phenolic microspheres with a phenolic resin to form a phenolic ablative material; compressing the phenolic ablative material into a honeycomb core; and allowing the phenolic ablative material to cure.