Conductive paste as well as conductive coating and conductive film prepared from same
US7998370B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2007 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Sep 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The task of the present invention is to offer a conductive paste that can be molded into a conductive coating or film that can maintain flexibility and ductility even while possessing a thickness of 50 μm˜125 μm. The conductive paste of the present invention includes a conductive particulate, a metal capture agent and a polyimide precursor solution. The metal capture agent can be selected as at least one from among either pyrimidinethiol compounds, triazinethiol compounds and imidazole compounds with a mercapto group. Moreover, the conductive particulate is preferably a core particle that is covered with a metal shell. In addition, a polyamic acid solution is preferred as the polyimide precursor solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.