Method of manufacturing through-via
US7998861B2 · kind B2 · utility
4Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2009 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Nov 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of manufacturing a through-via. The through-via manufacturing method includes forming a core-via hole in a wafer, forming a suction-via hole adjacent to the core-via hole in the wafer, forming a via core in the core-via hole, forming a polymer-via hole connected to the suction-via hole in the wafer, filling the polymer-via hole with polymer solution by creating a vacuum inside the polymer-via hole by drawing air out of the suction-via hole, and polishing the wafer such that the via core formed in the core-via hole is exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.