Cooling system for contact cooled electronic modules
US8000103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2008 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Mar 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.