Step-down transition of a solder head in the injection molding soldering process
US8002164B2 · kind B2 · utility
4Cited by
3References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 14, 2010 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Jun 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.