Cutting segment, method for manufacturing cutting segment, and cutting tool comprising the same
US8002858B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 14, 2006 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | May 10, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D1/121
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.