Forming method for polymeric laminated wafers comprising different film materials
US8002935B2 · kind B2 · utility
2Cited by
182References
7Claims
0Family size
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Key dates
| Filing date | Mar 6, 2006 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Jul 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24628
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials. Also disclosed is a laminated wafer wherein a first layer has different thermal properties than a second layer of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.