Process for forming a patterned thin film structure on a substrate
US8002948B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 12, 2007 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Apr 4, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.