Plating stand-off
US8002956B1 · kind B1 · utility
0Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2008 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Jun 24, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A stand-off for maintaining the separation between an electrode and an object during a flow-through electroplating process is disclosed. The stand-off comprises a substantially streamlined shape that mitigates the effects of shadowing during deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.