Manufacturing method of semiconductor device
US8003441B2 · kind B2 · utility
6Cited by
18References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2008 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Sep 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a semiconductor device according to the present invention comprises:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.