Curing composition with improved heat resistance
US8003744B2 · kind B2 · utility
34Cited by
41References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2004 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Feb 26, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L101/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a curable composition including: an organic polymer (A) which has on average 1.1 to 50 groups per one molecule thereof each represented by the general formula (1) and has one or more silicon-containing functional groups capable of cross-linking by forming siloxane bonds:—NR1—C(═O)— (1)wherein R1 is a hydrogen atom, or a substituted or unsubstituted monovalent organic group; and a metal carboxylate and/or a carboxylic acid (B), the curable composition giving a cured article excellent in curability and also excellent in heat resistance although a non-organotin catalyst is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.