Seal structure
US8003898B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2007 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | May 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.