Light-emitting diode arrangement

US8003998B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Georg Bogner · Lappersdorf, DE
• Stefan Grötsch · Regensburg, DE
• Gunter Waitl · Regensburg, DE
• Mario Wanninger · Regensburg, DE

Key dates

• Filing date: May 18, 2005
• Grant date: Aug 23, 2011
• Expiry date: May 18, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/856

Abstract

A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.