Wire-free chip module and method
US8004070B1 · kind B1 · utility
23Cited by
6References
27Claims
0Family size
Inventor
Key dates
| Filing date | Apr 29, 2008 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Sep 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire-free chip module and method. The wire-free chip module including a conductive pattern formed from at least a portion of a lead frame, the conductive pattern including a plurality of pads; at least two electrical components that includes an integrated circuit and a passive component, the integrated circuit and the passive component bonded to the plurality of pads by solder; and wherein the conductive pattern is disposed to interconnect at least a portion of the integrated circuit with the passive component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.