Semiconductor device and fabrication method
US8004074B2 · kind B2 · utility
48Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2008 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Jul 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device, in which a semiconductor element is mounted on one side of a circuit board that is made up from an insulating layer and a wiring layer, includes metal posts provided on the side of the circuit board on which the semiconductor element is mounted; and a sealing layer provided on the side of the circuit board on which the semiconductor element is mounted such that the semiconductor element is covered and such that only portions of the metal posts are exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.