Wafer level alignment structures using subwavelength grating polarizers
US8004678B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2007 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Jan 22, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7065
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In one embodiment, a wafer alignment system, comprises a radiation source to generate radiation, a radiation directing assembly to direct at least a portion of the radiation onto a surface of a wafer, the radiation having a polarization state, an optical analyzer to collect at least a portion of the radiation reflected from the wafer, the wafer including at least a first region having a first grating pattern oriented in a first direction and at least a second region having a second grating pattern oriented in a second direction, different from the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.