Method of assessing bond integrity in bonded structures
US8004689B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2007 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Jun 18, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/0423
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A technique for acoustic detection of a disbond within a bonded structure involves thermal excitation of the surface of the bonded structure to induce a lifting and membrane vibration and is applicable to laminates and coated structures, as well as foam core structures or a honeycomb structures. The technique does not require access to both sides of the bonded structure. A large etendue interferometer is used to provide surface displacement measurement. The surface displacement measurement can be analyzed both by frequency or amplitude to determine existence of a disbond by membrane vibration, and further a thickness of the disbond can be determined using traditional pulse-echo time analysis. The technique may allow detection of stick bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.