Slider with contact features initiated at wafer level
US8004796B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2007 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Jan 4, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3173
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is disclosed for producing sliders with protective contacts features the fabrication of which is initiated at the wafer level. Recesses are formed in the wafer, a protective material is provided in the recesses, and the wafer is sliced along the recesses and diced into sliders, such that the protective material forms corners of the sliders. The protective material may be disposed such that it has a low elastic modulus at the corners, and a higher elastic modulus at a displacement from the corners which is still lower than the elastic modulus of the slider body, thereby providing superior protection for potential contacts between the slider and an adjacent media surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.