Heat radiator
US8004846B2 · kind B2 · utility
10Cited by
36References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2009 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Apr 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.