Thermal comfort model having multiple fabric layers
US8005655B2 · kind B2 · utility
2Cited by
19References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2008 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Jun 18, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/367
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Modeling a plurality of fabric layers on a subject to predict thermal strain. The computerized model combines subject data, fabric data, and environmental conditions to simulate the thermal comfort of the subject over time. In an embodiment, a user interface enables a user to modify or define the input data to compare the predicted thermal comfort of different garments under the same working conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.