Component having a mechanical contact and method for producing the component
US8007292B2 · kind B2 · utility
3Cited by
10References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 14, 2009 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Aug 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component having a mechanical contact for connecting the component to a carrier, particularly a printed-circuit board, a coating made of an adhesive material being formed on the contact; the adhesive material containing an encapsulated adhesive substance. A method for producing a component to be mounted on a carrier, particularly on a printed-circuit board; the component being provided with a mechanical contact for connecting the component to the carrier; a coating made of an adhesive material being applied to the contact; the adhesive material having an encapsulated adhesive substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.