Manufacturing method for electronic device
US8007335B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2009 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Oct 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/211
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A manufacturing method for an electronic device, the method including forming a transparent conductive film, including conductive polymers, on a base material, and irradiating ultraviolet light onto a part of the transparent conductive film such that first regions of the transparent conductive film are not irradiated and second regions, adjacent to the first regions, are irradiated, thus forming irradiated portions and non-irradiated portions. The irradiated portions having an electrical resistance value higher than that of the non-irradiated portions. The ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers, of the transparent conductive film, two or more times higher than that of a background.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.