Parallel plate arrangement and method of formation
US8007609B2 · kind B2 · utility
6Cited by
17References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2007 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | May 23, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for forming a structure comprising multiple parallel surfaces having a precise separation is disclosed. Precise separation and parallelism of the surfaces is achieved through the use of an adhesive mixture that comprises a plurality of spacers having a dimension substantially equal to the desired separation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.