Printed circuit board providing heat dissipation
US8008579B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 19, 2008 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Aug 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes an insulated base sheet, a heat-conducting layer, and a plurality of heat-conducting blocks. The heat-conducting layer is disposed on the insulated base sheet. The heat-conducting blocks are formed on the heat-conducting layer. Each of the heat-conducting blocks is separated from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.