Micromachined piezoelectric ultrasound transducer arrays
US8008842B2 · kind B2 · utility
14Cited by
24References
8Claims
0Family size
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Key dates
| Filing date | Oct 27, 2008 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Jan 17, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A piezoelectric composite micromachined ultrasound transducer including single and multilayer 1-D and 2-D arrays having through-wafer-vias (TWVs) that significantly decreased electrical impedance per element, and hence the improved electrical impedance matching to T/R electronics and improved signal to noise ratio is disclosed. The TWVs facilitate integrated interconnection in single element transducers (positive and negative contact on the same side) and array transducers (contact pads array for integration with T/R switches and/or pre-amplifier circuits).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.