Heat transfer of processing systems
US8009420B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2009 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Dec 5, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A processing module may be provided. The processing module may include a mounting member configured to structurally support a first processing unit and receive thermal energy from the first processing unit through a coupling side of the first processing unit by conduction. The processing module may also include a base member coupled to the mounting member. The base member may be configured to receive thermal energy from the mounting member. A thermal conductivity of at least one of the mounting member and the base member may be greater than about 50 Watts/meter Celsius (W/m-C). Coefficients of thermal expansion (CTEs) of the mounting member, the base member, and the coupling side of the first processing unit may be matched.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.