Electrical component thermal management
US8009429B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2010 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Mar 22, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is separate from the thermally conductive attach pad, and an electrically conductive trace electrically connected to the electrically conductive attach pad. An electrical component can be electrically connected to the electrically conductive attach pad and the electrically conductive trace of the printed board. A thermal interface material is disposed adjacent at least a portion of a side surface of the electrical component and in contact with the thermally conductive attach pad. In this manner, the assembly may provide a thermally conductive pathway from an electrical component to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.