Electronic component cover and arrangement
US8009441B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2009 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Dec 21, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K7/0082
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.