Directing the flow of underfill materials using magnetic particles
US8009442B2 · kind B2 · utility
3Cited by
21References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2007 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Dec 28, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate and a die, and coupling the die to the substrate, wherein a gap remains between the die and the substrate. The method also includes placing an underfill material on the substrate and delivering at least part of the underfill material into the gap. The method also includes controlling the flow of the underfill material in the gap using magnetic force. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.