Method for fabricating clamping device for flexible substrate
US8011085B2 · kind B2 · utility
0Cited by
7References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 17, 2009 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Nov 6, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53196
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.