Pad for embossing device

US8011411B2 · kind B2 · utility

Assignee

• The Maitland Company, LLC · DE

Inventors

• Hans-Georg Eitel · Bad Homburg vor der Höhe, DE
• Rainer Gebhardt · Landgut Burg, DE
• Wolfgang Mexner · Adelsheim, DE
• Uwe Puschel · Grünstadt, DE
• Michael Reising · Mömbris, DE
• Guido Reschke · Bad Camberg, DE
• Jurgen Scholzig · Mainz, DE
• Michael Zinke · Schallstadt, DE

Key dates

• Filing date: Apr 13, 2005
• Grant date: Sep 6, 2011
• Expiry date: Aug 15, 2027

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B41P2219/51
• WIPO field: Textile and paper machines
• WIPO sector: Mechanical engineering

Abstract

For transferring an image-forming layer from a transfer foil a printing sheet, an adhesive layer is first applied to the sheet to be printed. The transfer foil provided with the image-forming layer is guided past the printing sheet under pressure, in a coating module (2), such that the image-forming layer adheres to the adhesive and an image is created. The present invention provides a foil transfer device that includes a substrate on the press cylinder that has a reduced adhesiveness relative to the transfer foil.