Molded ink manifold with polymer coating
US8011755B2 · kind B2 · utility
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1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2008 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Mar 8, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14419
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.