Mold, imprint apparatus, and process for producing structure
US8011916B2 · kind B2 · utility
12Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2006 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Nov 5, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In order to alleviate or suppress curing of a photocurable resin material in an area in which the curing of the photocurable resin material is not intended, exposure of the photocurable resin material to light is suppressed through a non-pattern portion at which a light-blocking member is provided by means of a mold having an imprint pattern portion and the non-pattern portion or is suppressed by disposing a light-blocking member so as not to irradiate the photocurable resin material with light not via the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.