Multilayer adhesive for thermal reversible joining of substrates
US8012292B2 · kind B2 · utility
2Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2007 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | May 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.