Dimensional control in electroforms
US8012329B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2008 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Jul 4, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/022
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method includes placing a conductive mold in a first bath of electroforming solution, the solution including metal and having a selected temperature. A current is provided to the electroforming solution so that metal deposits onto the mold, thereby forming an electroformed element on the mold, the electroformed element and the mold being a composite assembly. The method further includes removing the composite assembly from the electroforming solution and transferring the composite assembly to a second bath having the same selected temperature. Thereafter, the electroformed element is separated from the mold while the composite assembly is in the second bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.