White heat-curable silicone resin composition, optoelectronic part case, and molding method
US8013056B2 · kind B2 · utility
6Cited by
17References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 24, 2008 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Aug 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.